Grinding and Polishing
Chemical-Mechanical Polisher (CMP)- Logitech Tribo-1018
- 4” wafers and piece parts
- Available slurries: SF1 (30 nm grain size)
Contact: TBA
Location: CeNTech II, 2.03
Lapping and polishing system- Logitech PM6
- Process capacity of up to 4” wafers
- Plate speed: 5-100 rpm
- Lapping accuracy: 1-3 µm
- Roughness RMS: 2-3 nm
- In-situ measurement of the plate flatness
- Available slurries:
- Al2O3 (9 µm and 3 µm grain size)
- SF1 (30 nm grain size)
Location: CeNTech II, 2.03
Contact: TBA